2D Materials for conformable electronics

The integration of electronics with non-planar, flexible surfaces such as human skin or plant leaves opens new frontiers in wearable technologies, healthcare, and smart agriculture. In this presentation, we propose a hybrid fabrication approach to realize ultra-thin and conformable electronic devices by integrating monolayer MoS₂, a two-dimensional (2D) semiconductor, with printable PEDOT:PSS electrodes and nanometer-thick polyvinyl formal (PVF) dielectrics on micrometer-thick polyimide substrates. The resulting field-effect transistors (FETs) and circuits exhibit mechanical pliability, sub-5V operation, and robust electrical performance under bending, including successful operation on curved and irregular surfaces. This demonstration of scalable, low-temperature, and lithography-free processing of 2D materials establishes a promising platform for future conformable electronics.